ROSNN 3106 is a 1mil Polyimide backing with special acrylic adhesive designed for protecting surface exposing to high-temperature application without silicone contamination, especially For PCB masking.
Acrylic adhesive
Hi-temperature Resistant
Anti-Static
Non-Silicone
No Build Up in 180 Peel to SUS After Aging
|
Property |
Unit |
Tolerance |
Value |
|
Appearance |
NO impurity |
||
|
Total Thickness |
Mm |
±0.005 |
0.050 |
|
180 Peel to SUS* |
g/in |
±10.0 |
200.0 |
|
Heat Shock |
No residue after 30mins@260℃ |
||
|
Dielectric Strength: |
v |
- |
>6000 |
|
Surface Resistance |
±1.0E01 |
1.0E10 |
|
|
Tensile Strength |
N/25mm |
- |
>120 |
|
Elongation at Break |
% |
- |
>60 |
|
RoHS |
Pass |
||
|
Halogen |
Cl<50ppm, Br <50pp |
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